View WS1403-BLK_7141947.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

ws1403 cdma pcs 3x3 power amplifer module (1850-1910 mhz) data sheet description thefws1403fisfafcdmafpersonalfcommunicationfservicef (pcs)f powerf ampliferf (pa),f designedf forf handsetsf operatingfinfthef1850~1910fmhzfbandwidth.f digitalf modef controlf off coolpamf reducesf currentf consumption,f whichf enablesf extendedf talkf timef off mobilefdevices. thef ws1403f meetsf stringentf cdmaf linearityf requirementsftofandfbeyondf28fdbmfoutputfpower.fthef 3f mmf xf 3f mmf formf factorf 8-pinf surfacef mountf package f isfselffcontained,fincorporatingf50fohmfinputfandfoutputf matchingfnetworks. functional block diagram v cc2 (5) v cont (2) v ref (1) rf output (6) da input ma tch inter st age ma tch output ma tch module mmi c pa rf input (3) v cc1 (4) bias circuit & control logic features ? f excellentflinearityf ? f lowfquiescentfcurrent ? f highfefciency f f paefatf28fdbm:f39.8% f f paefatf17fdbm:f22.3% ? f 8-pinfsurfacefmountingfpackage f f 3fmmfxf3fmmfxf1.0fmm ? f internalf50fohmfmatchingfnetworksfforfbothfrffinputf andfoutput ? f rohsfcompliant applications ? f digitalfcdmafpcs ? f wirelessflocalfloop order information part number no. of devices container ws1403-tr1 1,000 7ftapefandfreel WS1403-BLK 100 bulk
2 table 1. absolute maximum ratings [1] parameter symbol min. nominal max. unit rffinputfpower pin Cf Cf 10.0 dbm dcfsupplyfvoltage vcc 0f 3.4 5.0 v referencefvoltage vref 0f 2.85 3.3 v controlfvoltage vcont 0 2.85 3.3 v storageftemperature tstg -55 Cf +125 c table 2. recommended operating condition parameter symbol min. nominal max. unit dcfsupplyfvoltage vcc 3.2 3.4f 4.2 v dcfreferencefvoltage vref 2.75 2.85 2.95 v modefcontrolfvoltage f Cfhighfpowerfmode f Cflowfpowerfmode vcont vcont 0 2.0 0 2.85 0.5 3.0 v v operatingffrequency fo 1850 1910 mhz ambientftemperature ta -30 25 85 c table 3. power range truth table power mode symbol vref vcont [2] range highfpowerfmode pr2 2.85 low ~f28fdbm lowfpowerfmode pr1 2.85 high ~f17fdbm shutfdownfmode C 0 - C notes: 1.ffffnofdamagefassumingfonlyfonefparameterfisfsetfatflimitfatfaftimefwithfallfotherfparametersfsetfatforfbelowfnominalfvalue. 2.ffffhighf(2.0fCf3.0fv),flowf(0.0fvfCf0.5fv).f
3 table 4. electrical characteristics for cdma mode (vcc = 3.4 v, vref = 2.85 v, t = 25c, zin/zout = 50 ohm) characteristics symbol condition min. typ. max. unit operatingffrequencyfrange f f 1850 C 1910 mhz gain gain_hi highfpowerfmode,fpoutf=f28fdbmf 24 28 db gain_low lowfpowerfmode,fpoutf=f17fdbm 14 18 db powerfaddedfefciency pae_hi highfpowerfmode,fpoutf=f28fdbmf 35.6 39.8 % pae_flow lowfpowerfmode,fpoutf=f17fdbm 16.1 22.3 % totalfsupplyfcurrent icc_hi highfpowerfmode,fpoutf=f28fdbmf 465 520 ma icc_flow lowfpowerfmode,fpoutf=f17fdbm 65 90 ma quiescentfcurrent iq_hi highfpowerfmode 91 125 ma iq_flow lowfpowerfmode 12 22 ma referencefcurrent iref_hi highfpowerfmode,fpoutf=f28fdbmf 2 7 ma iref_low lowfpowerfmode,fpoutf=f17fdbm 3.3 8 ma controlfcurrent icont lowfpowerfmode,fpoutf=f17fdbm 0.19 1 ma totalfcurrentfinfpower-downf mode ipd vreff=f0fv 0.2 5 a adjacent channel power ratio 1.25fmhzfofset acpr1_hi highfpowerfmode,fpoutf=f28fdbm -52 -47 dbc 1.98fmhzfofset acpr2_hi -59 -56 dbc 1.25fmhzfofset acpr1_flow lowfpowerfmode,fpoutf=f17fdbm -54 -47 dbc 1.98fmhzfofset acpr2_flow -65 -56 dbc harmonic suppression second 2f0 highfpowerfmode,fpoutf=f28fdbm -40 -33 dbc third 3f0 -64 -45 dbc inputfvswr vswr f 1.4:1 2.0:1 stabilityf(spuriousfoutput) s vswrf6:1,fallfphase -60 dbc noisefpowerfinfrxfband rxbn -137 -133 dbm/hz ruggedness f nofdamage poutf<28fdbm,fpinf<10fdbm,fallfphase highfpowerfmode 10:1 vswr
4 characteristics data (vcc = 3.4 v, vref = 2.85 v, t = 25c, zin/zout = 50 ohm) figure 4. adjacent channel power ratio 1 vs. output power figure 1. total current vs. output power figure 2. gain vs. output power figure 3. power added efciency vs. output power figure 5. adjacent channel power ratio 2 vs. output power 0 50 10 0 15 0 20 0 25 0 30 0 35 0 40 0 45 0 50 0 0 5 10 15 20 25 30 po ut (d bm ) current (ma) 1850 mhz 1880 mhz 1910 mhz 10 15 20 25 30 35 0 5 10 15 20 25 30 pout (dbm) gain (db) 1850 mhz 1880 mhz 1910 mhz 0 20 15 10 5 25 30 35 45 40 0 5 10 15 20 25 30 pout (dbm) pae (%) 1850 mhz 1880 mhz 1910 mhz -75 -55 -60 -65 -70 -50 -45 -40 0 5 10 15 20 25 30 pout (dbm) acpr1 (dbc) 1850 mhz 1880 mhz 1910 mhz -75 -80 -85 -55 -60 -65 -70 -50 0 5 10 15 20 25 30 pout (dbm) acpr2 (dbc) 1850 mhz 1880 mhz 1910 mhz
5 evaluation board description figure 6. evaluation board schematic 1 vref 3 rf in 2 vcont 4 vcc1 vcc2 5 rf out 6 gnd 8 gnd 7 vref vcont rf in vcc1 vcc2 rf out c1 100pf c5 2.2 f c4 100pf c6 2.2 f c2 150pf c3 100pf 0 ohm r1 figure 7. evaluation board assembly diagram 1403 pyyww aaaaa 3 4
6 figure 8. package dimensional drawing and pin descriptions (all dimensions are in millimeters) package dimensions and pin descriptions figure 9. marking specifcations pin 1 mark manufacturing part number lot number p manufacturing info yy manufacturing year ww work week aaaaa assembly lot 1403 pyyww aaaaa 0 . 8 0 1 . 4 0 1 . 4 0 1 2 3 3 0 . 1 p i n 1 m a r k 3 0 . 1 t o p v i e w s i d e v i e w x - r a y b o t t o m v i e w p i n d e s c r i p t i o n s 4 8 7 6 5 0 . 7 0 . 4 0 1 . 0 0 . 1 0 . 6 0 3 . 0 1 . 2 0 2 . 8 0 0 . 1 5 x 4 5 r 0 . 1 0 0 . 4 0 0 . 4 0 p i n # 1 2 3 4 5 6 7 8 n a m e v r e f v c o n t r f i n v c c 1 v c c 2 r f o u t g n d g n d d e s c r i p t i o n r e f e r e n c e v o l t a g e c o n t r o l v o l t a g e r f i n p u t s u p p l y v o l t a g e s u p p l y v o l t a g e r f o u t p u t g r o u n d g r o u n d
7 peripheral circuit in handset figure 10. peripheral circuit notes: ?fff recommendedfvoltagefforfvreffisf2.85fv. ?fff placefc1fnearftofvreffpin. ?fff placefc3fandfc4fcloseftofpinf4f(vcc1)fandfpinf5f(vcc2).fthesefcapacitorsfcanfafectfthefrffperformance. ?fff usef50f w ftransmissionflinefbetweenfpamfandfduplexerfandfmakefitfasfshortfasfpossibleftofreducefconductionfloss. ?ff -typefcircuitftopologyfisfgoodftofusefforfmatchingfcircuitfbetweenfpafandfduplexer. calibration calibrationf proceduref isf shownf inf figuref 11.f twof calibrationftables,fhighfmodefandflowfmodefrespectively,f arefrequiredfforfcoolfpam,fwhichfisfdueftofgainfdiferencef infeachfmode.fforfcontinuousfoutputfpowerfatfthefmodef changef points,f thef inputf powerf shouldf bef adjustedf accordingftofgainfstepfduringfthefmodefchange. figure 11. calibration procedure figure 12. setting of ofset between rising and falling power tx_agc low mode high mode min. pw r falling rising max. pw r pout gain low mode high mode falling rising pout ofset value (diference between rising point and falling point) ofsetfvalue,fwhichfisfthefdiferencefbetweenfthefrisingf pointf(outputfpowerfwherefpafmodefchangesffromflowf modef tof highf mode)f andf fallingf pointf (outputf powerf wherefpafmodefchangesffromfhighfmodeftoflowfmode),f shouldfbefadoptedftofpreventfsystemfoscillation.f3ftof5f dbfisfrecommendedfforfhysteresis. duplexer tx filter msm pa_ro pa_on rf out output matching circuit rf in c1 c8 c7 c6 l1 c2 v batt c5 c4 c3 +2.85 v ws1403 vref gnd vcont gnd rf in rf out vcc2 vcc1
8 figure 14. metallization stencil design guidelines afproperlyfdesignedfsolderfscreenforfstencilfisfrequiredf tofensurefoptimumfamountfoffsolderfpastefisfdepositedf ontofthefpcbfpads.f thefrecommendedfstencilflayoutfisfshownfinffiguref16.f reducingf thef stencilf openingf canf potentiallyf generatef morefvoids.fonfthefotherfhand,fstencilfopeningsflargerf thanf100%fwillfleadftofexcessivefsolderfpastefsmearforf bridgingf acrossf thef i/of padsf orf conductivef paddlef tof adjacentfi/ofpads.fconsideringftheffactfthatfsolderfpastef thicknessf willf directlyf afectf thef qualityf off thef solderf joint,fafgoodfchoicefisftofuseflaserfcutfstencilfcomposedf off0.100fmmf(4fmils)forf0.127fmmf(5fmils)fthickfstainlessf steelf whichf isf capablef off producingf thef requiredf fnef stencilfoutline. figure 16. solder paste stencil aperture figure 15. solder mask opening 0.1 0.25 0.6 0.5 0.4 0.8 ? 0.3 mm on 0.5 mm pitch 0.8 0.5 0.7 0.55 1.4 1.325 0.4 0.6 0.5 0.8 1.05 1.1 average current & talk time probabilityf distributionf functionf impliesf thatf whatf isf importantf forf longerf talkf timef isf thef efciencyf off lowf orf mediumf powerf rangef ratherf thanf thef efciencyf atf fullfpower.fws1403fidlefcurrentfisf12fmafandfoperatingf currentfatf17fdbmfisf65fmafatfnominalfcondition.fthisfpaf withflowfcurrentfconsumptionfprolongsftalkftimefbyfnof lessfthanf30fminutesfcomparedftofotherfpas. averagefcurrentf=f(pdffxfcurrent)dp pcb design guidelines thef recommendedfws1403f pcbf landf patternf isf shownf inffiguref14fandffiguref15.fthefsubstratefisfcoatedfwithf solderfmaskfbetweenfthefi/ofandfconductivefpaddleftof protectfthefgoldfpadsffromfshortfcircuitfthatfisfcausedfbyf solderfbleeding/bridging.f figure 13. cdma power distribution function 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0 700 600 cdg urban conventional pa m digitally controlled pa m cool pa m cdg suburban 500 400 300 200 100 0 -50 -40 -30 -20 -10 pa out (dbm) 0 pdf (%) current (ma) 10 20 30
9 figure 17. tape and reel format C 3 mm x 3 mm tape and reel information p0 y y p2 (1) p10 (3) d0 dimensions no ta tion millimeters a0 3.40 0.10 b0 3.40 0.10 k0 1.35 0.10 d0 1.55 0.05 d1 1.60 0.10 p0 4.00 0.10 p1 8.00 0.10 p2 2.00 0.05 p10 40.00 0.20 e 1.75 0.10 f 5.50 0.05 w 12.00 0.30 t 0.30 0.05 x x p1 (2) d1 f (1) w a section x - x section y - y a0 k0 0.1 r 0.5 r 1.0 det ail a t b0 1403 pyyww aaaaa f
10 reel drawing figure 18. plastic reel format (all dimensions are in millimeters) back view front view
11 table 6. moisture classifcation level and floor life msl level floor life (out of bag) at factory ambient = < 30c/60% rh or as stated 1 unlimitedfatf=f 12 figure 19. typical smt refow profle for maximum temperature = 260 +0/-5c table 7. typical smt refow profle for maximum temperature = 260 +0/-5c profle feature sn-pb solder pb-free solder averageframp-upfratef(tlftoftp) 3c/secfmax 3cf/secfmax preheat f -ftemperaturefminf(tsmin) f -ftemperaturefmaxf(tsmax) f -ftimef(minftofmax)f(ts) 100c 150c 60-120fsec 150c 200c 60-180fsec tsmaxftoftl f -framp-upfrate 3cf/secfmax timefmaintainedfabove: f -ftemperaturef(tl) f -ftimef(tl) 183c 60-150fsec 217c 60-150fsec peakftemperaturef(tp) 240f+0/-5c 260f+0/-5c timefwithinf5cfoffactualfpeakftemperaturef(tp) 10-30fsec 20-40fsec ramp-downfrate 6c/secfmax 6c/secfmax timef25cftofpeakftemperature 6fminfmax. 8fminfmax. tim e tempera ture tp t 25 c to peak ts prehea t t l t p ts max ts min t l critical zone t l to t p ramp up ramp dow n 25
13 storage condition packagesf describedf inf thisf documentf mustf bef storedf infsealedfmoisturefbarrier,fantistaticfbags.fshelfflifefinfaf sealedfmoisturefbarrierfbagfisf12fmonthsfatf<40cfandf 90%frelativefhumidityf(rh)fj-std-033fp.7. out-of-bag time duration afterfunpacking,fthefdevicefmustfbefsolderedftofthefpcbf withinf 168f hoursf asf listedf inf thef j-std-020bf p.11f withf factoryfconditionsf<30cfandf60%frh. baking itfisfnotfnecessaryftofre-bakefthefpartfiffbothfconditionsf (storagef conditionsf andf out-off bagf conditions)f havef beenf satisfed.f bakingf mustf bef donef iff atf leastf onef of f thefconditionsfabovefhavefnotfbeenfsatisfed.fthefbakingf conditionsfaref125cfforf12fhoursfj-std-033fp.8. caution tapefandfreelfmaterialsftypicallyfcannotfbefbakedfatfthef temperaturef describedf above.f iff out-of-bagf exposuref timefisfexceeded,fpartsfmustfbefbakedfforfaflongerftimef atflowftemperatures,forfthefpartsfmustfbefde-reeled,fde- taped,fre-bakedfandfthenfputfbackfonftapefandfreel.f(seef moisturefsensitivefwarningflabelfonfeachfshippingfbagf forfinformationfoffbaking). board rework component removal, rework and remount iff af componentf isf tof bef removedf fromf thef board,f itf isf recommendedf thatf localizedf heatingf bef usedf andf thef maximumf bodyf temperaturesf off anyf surfacef mountf componentf onf thef boardf notf exceedf 200c.f this f methodf willf minimizef moisturef relatedf componentf damage.fiffanyfcomponentftemperaturefexceedsf200c,f thef boardf mustf bef bakedf dryf perf 4-2f priorf tof rework f and/orf componentf removal.f componentf temperaturesf shallfbefmeasuredfatftheftopfcenterfoffthefpackagefbody.f anyf smdf packagesf thatf havef notf exceededf theirf foor f lifefcanfbefexposedftofafmaximumfbodyftemperaturefasf highfasftheirfspecifedfmaximumfrefowftemperature. removal for failure analysis notf followingf thef abovef requirementsf mayf cause f moisture/refowf damagef thatf couldf hinderf or f completelyf preventf thef determinationf off thef originalf failurefmechanism. baking of populated boards somef smdf packagesf andf boardf materialsf aref notf ablef tofwithstandflongfdurationfbakesfatf125c.fexamplesfoff thisfarefsomeffr-4fmaterials,fwhichfcannotfwithstandfaf 24fhrfbakefatf125c.fbatteriesfandfelectrolyticfcapacitorsf aref alsof temperaturef sensitive.f withf componentf andf boardf temperaturef restrictionsf inf mind,f choosef af bakef temperaturef fromf tablef 4-1f inf j-stdf 033;f then f determinefthefappropriatefbakefdurationfbasedfonfthef componentftofbefremoved.fforfadditionalfconsiderationsf seefipc-7711fandfipc-7721. derating due to factory environmental conditions factoryffoorflifefexposuresfforfsmdfpackagesfremovedf fromf thef dryf bagsf willf bef af functionf off thef ambientf environmentalf conditions.f af safe,f yetf conservative,f handlingfapproachfisftofexposefthefsmdfpackagesfonly f upf tof thef maximumf timef limitsf forf eachf moisturef sensitivityf levelf asf shownf inf tablef 7.f thisf approach,f however,f doesf notf workf iff thef factoryf humidityf orf temperaturef isf greaterf thanf thef testingf conditionsf off 30c/60%f rh.f af solutionf forf addressingf thisf problem f isftofderatefthefexposureftimesfbasedfonfthefknowledgef off moisturef difusionf inf thef componentf packagef materialsf ref.f jesd22-a120).f recommendedf equivalentf totalf foorf lifef exposuresf canf bef estimatedf forf af rangef off humiditiesf andf temperaturesf basedf onf thef nominalf plasticfthicknessfforfeachfdevice. tablef8flistsfequivalentfderatedffoorflivesfforfhumiditiesf rangingf fromf 20-90%f rhf forf threef temperature,f 20c,f 25c,fandf30c. thisf tablef isf applicablef tof smdsf moldedf withf novolac,f biphenylf orf multifunctionalf epoxyf moldf compounds.f thef followingf assumptionsf weref usedf inf calculatingf tablef8: 1.f activationfenergyfforfdifusionf=f0.35evf(smallestf knownffvalue). 2.f forf60%frh,fusefdifusivityf=f0.121expf(f-0.35ev/kt)f mm2/s f (thisfusedfsmallestfknownfdifusivityf@f30c). 3.f forf>60%frh,fusefdifusivityf=f1.320expf(f-0.35ev/kt)f mm2/s f (thisfusedflargestfknownfdifusivityf@f30c).
14 table 8. recommended equivalent total floor life (days) @ 20c, 25c and 30c for ics with novolac, biphenyl and multifunc - tional epoxies (refow at same temperature at which the component was classifed) maximum percent relative humidity package type and body thickness moisture sensitivity level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% bodyfthickness 3.1fmm including pqfpsf>84fpin, plccsf(square) allfmqfps or allfbgasf1fmm levelf2a 60 78 103 41 53 69 33 42 57 28 36 47 10 14 19 7 10 13 6 8 10 30c 25c 20c levelf3 10 13 17 9 11 14 8 10 13 7 9 12 7 9 12 5 7 10 4 6 8 4 5 7 30c 25c 20c levelf4 5 6 8 4 5 7 4 5 7 4 5 7 3 5 7 3 4 6 3 3 5 2 3 4 2 3 4 30c 25c 20c levelf5 4 5 7 3 5 7 3 4 6 2 4 5 2 3 5 2 3 4 2 2 3 1 2 2 1 2 3 30c 25c 20c levelf5a 2 3 5 1 2 4 1 2 3 1 2 3 1 2 3 1 2 2 1 1 2 1 1 2 1 1 2 30c 25c 20c bodyf2.1fmm fthickness <3.1fmmfincluding plccsf(rectangular) 18-32fpin soicsf(widefbody) soicsf20fpins, pqfpsf80fpins levelf2a 86 148 39 51 69 28 27 49 4 6 8 3 4 5 2 3 4 30c 25c 20c levelf3 19 25 32 12 15 19 9 12 15 8 10 13 7 9 12 3 5 7 2 3 5 2 3 4 30c 25c 20c levelf4 7 9 11 5 7 9 4 5 7 4 5 6 3 4 6 3 4 5 2 3 4 2 2 3 1 2 3 30c 25c 20c levelf5 4 5 6 3 4 5 3 3 5 2 3 4 2 3 4 2 3 4 1 2 3 1 1 3 1 1 2 30c 25c 20c levelf5a 2 2 3 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 1 2 0.5 1 2 0.5 1 1 30c 25c 20c bodyfthickness <2.1fmm including soicsf<18fpin allftqfps,ftsopsfor allfbgasf<1fmmfbody thickness levelf2a 28 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf3 11 14 20 7 10 13 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf4 9 12 17 5 7 9 4 5 7 3 4 6 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf5 13 18 26 5 6 8 3 4 6 2 3 5 2 3 4 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf5a 10 13 18 3 5 6 2 3 4 1 2 3 1 2 2 1 2 2 1 1 2 1 1 2 0.5 1 1 30c 25c 20c
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. av02-0291en - august 26, 2008

▲Up To Search▲

Price & Availability of WS1403-BLK

	To Download WS1403-BLK Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .